News
Notice Regarding Issuance of Unsecured Straight Bonds
Oct 20, 2021
TechnoPro Holdings, Inc. hereby announces that it has today determined the following terms and conditions for the issuance of its 1st and 2nd Series of Unsecured Straight Bonds.
| TechnoPro Holdings, Inc. 1st Series Unsecured Straight Bonds (with inter-bond pari passu clause) | TechnoPro Holdings, Inc. 2nd Series Unsecured Straight Bonds (with inter-bond pari passu clause) | |
|---|---|---|
| 1. Total issue amount | 5 billion yen | 5 billion yen |
| 2. Denomination per bond | 100 million yen | |
| 3. Coupon rate | 0.130% per annum | 0.200% per annum |
| 4. Issue price | 100% of the principal amount | |
| 5. Coupon payment date | April 26 and October 26 of each year (First coupon payment date: April 26, 2022) | |
| 6. Maturity date | October 25, 2024 (3 years) | October 26, 2026 (5 years) |
| 7. Issue date | October 26, 2021 | |
| 8. Underwriters | SMBC Nikko Securities Inc., Daiwa Securities Co. Ltd. and Mitsubishi UFJ Morgan Stanley Securities Co., Ltd. | |
| 9. Fiscal agent | Sumitomo Mitsui Banking Corporation | |
| 10. Credit rating | A- (Rating and Investment Information, Inc.) | |
This press release has been prepared for the sole purpose of publicly announcing the terms and conditions of the TechnoPro Holdings, Inc.’s issuance of unsecured straight bonds and not for the purpose of soliciting investment or engaging in any other similar activities.
(Note on translation)
This document is provided for informational purpose only. If there are any discrepancies between this and the original, the original Japanese document prevails.